Manufacturing Industry News: STMicroelectronics Pushes Forward with Advanced Chip Innovation in France
STMicroelectronics, among the most successful European semiconductor makers have recently declared to invest in its Tours plant in France to the tune of US 60 million. It aims to establish a pilot line of Panel-Level Packaging (PLP) technology in Q3 2026. This action is part of a larger reorganization initiative, which started in October of last year, realigning some of the chipmaking lines of its older technologies out of Tours, cost-reduction initiatives and redefining of functions of multiple locations in France and Italy. What Is Panel-Level Packaging (PLP) & Why It Is Important. PLP is a semiconductor packaging technology that is relatively new. PLP has square panels as opposed to the traditional methods that employ circular silicon wafers. This offers advantages like: Less manufacturing processes; this may save money and time. Increased automation and economies of scale, which is very favorable when it comes to establishing increased capacity in areas where the costs of labo...